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(R)
SM6HT
HIGH TEMPERATURE TRANSILTM FOR AUTOMOTIVE APPLICATIONS
FEATURES High performance TRANSIL designed to fit high temperature environment like automotive applications High reliability planar technology High performance in voltage regulation mode Very low leakage current: IR max. = 5A @ Tamb = 150C

Peak pulse power: 600W (10/1000s) Fast response time Unidirectinal type Low clamping factor
SMB (JEDEC DO-214AA) Table 1: Order Codes Part Number SM6HTxxx Marking See page 2
DESCRIPTION This high performance Transil series has been designed to fit high temperature environment such as automotive applications, using surface mount technology. These devices are using high reliability planar technology resulting in high performances in voltage regulation mode and low leakage current at high temperature. Table 2: Absolute Maximum Rating (Tamb = 25C) Symbol PPP P IFSM Parameter Peak pulse power dissipation (see note 1) Power dissipation on infinite heatsink Non repetitive surge peak forward current for unidirectional types
Value Tj initial = Tamb Tamb = 50C tp = 10 ms Tj initial = Tamb 600 5 75 -65 to 175 260
Unit W W A C C
Tstg / Tj Storage and operating junction temperature range TL Maximum lead temperature for soldering during 10 s.
Note 1: for a surge greater than the maximum values, the diode will fail in short-circuit.
Table 3: Thermal Resistances Symbol Parameter Rth(j-l) Junction to leads Rth(j-a) Junction to ambient on printed circuit on recommended pad layout Value 20 100 Unit C/W C/W
January 2005
REV. 5
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SM6HT
Table 4: Electrical Characteristics (Tamb = 25C) Symbol VRM VBR VCL IRM IPP VF Parameter
IF I
Stand-off voltage Breakdown voltage Clamping voltage Leakage current Peak pulse current Forward voltage drop
IPP VCL VBR VRM IRM VF V
Types
Marking
IRM
@
VRM
VBR note1 min
@
IR
VCL @ IPP 10/1000s max
T max note2
Tamb=25C Tamb=150C max A SM6HT24A SM6HT27A SM6HT30A SM6HT36A SM6HT39A SM6HT43A
Note 1: Note 2:
max A V
nom max V 24 27 30 36 39 43 V 25.2 28.4 31.5 37.8 41.0 45.2 1 mA
V
V
A
10-4/C 9.4 9.6 9.7 9.9 10.0 10.1
EMB EPB ERB EVB EXB EYB 2 5
20.5 22.8 23.1 25.7 25.6 28.5 30.8 34.2 33.3 37.1 36.8 40.9
33.2 18.0 37.5 16.0 41.5 14.5 49.9 12.0 53.9 11.1 59.3 10.1
Pulse test : tp < 50 ms.
VBR = T x (Tamb - 25) x VBR(25C).
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SM6HT
Figure 1: Peak power dissipation versus initial junction temperature
PPP[Tj initial] / PPP[Tj initial=25C]
1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 25 50 75 100 125 150 175 200
Figure 2: Continuous power versus ambient temperature
P(W)
6
Rth(j-a)=Rth(j-l)
dissipation
5
4
3
2
Rth(j-a)=100C/W
1
Tj initial(C)
0 0 25 50
Tamb(C)
75 100 125 150 175
Figure 3: Peak pulse power versus exponential pulse duration (Tj initial=25C)
PPP(kW)
10.0
Figure 4: Clamping voltage versus peak pulse current (Tj initial=25C)
IPP(A)
1E+2
SM6HT27A SM6HT30A SM6HT36A SM6HT39A SM6HT24A
tp = 20s
1E+1
SM6HT43A
1.0
1E+0
tp = 1ms
tp(ms)
0.1 0.01 0.10 1.00 10.00
1E-1 10
VCL(V)
100
Figure 5: Junction capacitance versus reverse applied voltage (typical values)
C(pF)
1000
F=1MHz
Figure 6: Peak forward voltage drop versus peak forward current (typical values)
IFM(A)
100.0
500
Tj=175C
10.0
SM6HT24A
Tj=25C
SM6HT27A
200
1.0
SM6HT30A SM6HT36A SM6HT39A
100 1 10
VR(V)
SM6HT43A
VFM(V)
0.1
100
200
0.5
1.0
1.5
2.0
2.5
3.0
3.5
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SM6HT
Figure 7: Variation of thermal impedance junction to ambient versus pulse duration (Printed circuit board FR4 with recommended pad layout)
Zth(j-a)(C/W)
1E+2
Figure 8: Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board FR4, e(Cu)=35m)
Rth(j-a)(C/W)
100
90
1E+1
80
70
1E+0
60
50
tp(ms)
1E-1 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
40 0 1 2
S(cm)
3 4 5
Figure 9: Variation of leakage current versus junction temperature (typical values)
IR(A)
2E+0
1E+0
1E-1
4E-2 25 50 75
Tj(C)
100 125 150 175
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SM6HT
Figure 10: SMB Package Mechanical Data
E1
DIMENSIONS REF.
D
Millimeters Min. Max. 2.45 0.20 2.20 0.41 5.60 4.60 3.95 1.60 1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75
Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.063
A1 A2 b
E
c
A1
E E1 D
b
C L
A2
L
Figure 11: Foot Print Dimensions (millimeters)
2.3
1.52
2.75
1.52
Table 5: Ordering Information Part Number SM6HTxxx Marking See page 2 Package SMB Weight 0.107 g Base qty 2500 Delivery mode Tape & reel
Table 6: Revision History Date Apr-1999 26-Jan-2005 Revision 4A 5 Last update. Figure 9 on page 4: leakage current improved. Description of Changes
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SM6HT
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
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